(footprint SAMTEC_HTSW-103-08-L-D-NA (layer F.Cu) (tedit 65744FEA)
  (descr "")
  (fp_text reference REF** (at -1.635 -7.88 0) (layer F.SilkS))
  (fp_text value SAMTEC_HTSW-103-08-L-D-NA (at 11.065 9.715 0) (layer F.Fab))
  (pad 01 thru_hole rect (at -2.54 -2.77) (size 1.37 1.37) (drill 1.02) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 02 thru_hole circle (at -2.54 -5.31) (size 1.37 1.37) (drill 1.02) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 03 thru_hole circle (at 0.0 -2.77) (size 1.37 1.37) (drill 1.02) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 04 thru_hole circle (at 0.0 -5.31) (size 1.37 1.37) (drill 1.02) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 05 thru_hole circle (at 2.54 -2.77) (size 1.37 1.37) (drill 1.02) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 06 thru_hole circle (at 2.54 -5.31) (size 1.37 1.37) (drill 1.02) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
)